Improving LED display performance through low heat dissipation

The heat dissipation of stage LED display screen will have different considerations according to the power and the place of use. ก 6032 1, air hydrodynamics, the use of lamp shell shape, to produce convective air, which is the lowest cost way to strengthen heat dissipation.

2 2, thermal conductive plastic shell, filled with thermal conductive materials during plastic shell injection molding, to increase the thermal conductivity and heat dissipation capacity of the plastic shell.

3, aluminum heat sink, this is the most common way of heat dissipation, using aluminum fins as a part of the shell to increase the heat dissipation area of LED display.

4, LED display surface radiation heat treatment, lamp shell surface radiation heat treatment, simple is to paint radiation heat dissipapipe technology, the heat from the LED full-color display chip to the shell heat sink fin. In large luminaires, such as street lamps, are common designs.6, fan heat dissipation, lamp shell with a long-life and efficient fan to strengthen the heat dissipation, this method is low cost, good effect. อย่างไรก็ตาม, to change the fan is troublesome, and it is not suitable for outdoor LED display, this design is relatively rare. The transparent liquid with high thermal conductivity is filled into the bulb of lamp body by using liquid bulb packaging technology. In addition to the principle of reflection, this is the only technology using LED chip to conduct heat and heat. The purpose of lamp shell heat dissipation is to reduce the working temperature of LED full-color display chip. Because the expansion coefficient of LED chip is very different from the expansion coefficient of metal heat conduction and heat dissipation materials, the LED display core can not be directly welded to avoid high and low temperature thermal stress damaging the LED full-color display chip. The latest high thermal conductivity ceramic material, thermal conductivity close to aluminum, expansion system can be adjusted to synchronize with LED full-color display chip. In this way, heat conduction and heat dissipation can be integrated to reduce the intermediate process of heat conduction.